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Stack up: 1 layer double side CCL

+ 2 layers single side CCL + 2 layers PCB

Base material: 1/2 mil PI

CCL: 1 mil PI, 1/2oz, 13um adhesive double ED copper

Cover layer: 1/2 mil, 25um

Minimum line width: 0.09mm

Minimum line space: 0.07mm

Minimum hole diameter: 0.20mm

Surface treatment:ENIG plating

Solder mask: Green

Stiffener: N/A